DTU 02208: Assignment 13c

Assignments

02208 Test of Integrated Circuits
Assignment: Bridging faults

The traditional single stuck-at fault model is the most common fault model used for test pattern generation and fault simulation for integrated circuits. However, a large fraction of occuring physical defects in contemporary CMOS technologies are not correctly modeled, and must be modeled separately using different models.

Results from inductive fault analysis have demonstrated that the most commonly occuring type of faults resulting from fabrication defects is the bridging fault. However, shorts may be missed by test sets achieving full single stuck fault coverage. The inadequacy of the single stuck-at fault model implies that prediction of IC quality using only this model is not accurate.

To assure low defect levels, bridging defects must be covered by the production test sets. Quiescent power supply current (IDDQ) testing has been shown to be effective in CMOS bridging fault detection. However, the IDDQ test set is limited in size due to slow application rate. Therefore, logic-based test sets are generated for at-speed testing.

Based on the literature below, the following issues must be discussed:

References


[02208 homepage]       Modified by Flemming Stassen on 7 October 2002     stassen@imm.dtu.dk