|
02208 Test of Integrated Circuits |
The traditional single stuck-at fault model is the most common fault
model used for test pattern generation and fault simulation for
integrated circuits.
However, a large fraction of occuring physical defects in contemporary
CMOS technologies are not correctly modeled, and must be modeled separately
using different models.
Results from inductive fault analysis have demonstrated that the most
commonly occuring type of faults resulting from fabrication defects
is the bridging fault. However, shorts may be missed by test sets
achieving full single stuck fault coverage. The inadequacy of the single
stuck-at fault model implies that prediction of IC quality using only
this model is not accurate.
To assure low defect levels, bridging defects must be covered by the
production test sets. Quiescent power supply current (IDDQ)
testing has been shown to be effective in CMOS bridging fault detection.
However, the IDDQ test set is limited in size due to slow
application rate. Therefore, logic-based test sets are generated for
at-speed testing.
Based on the literature below, the following issues must be discussed: